Request Quote from Ultra T Equipment

First Name*

Last Name*

Phone

Email Address*

Application Information

Which applications are you interested in?*

Wafer / Photomask / Substrate Cleaning
Chemical Etch & Strip
Resist Strip
Post-CMP Cleaning
Spin Coating
In-Line Reionization
Other / Comments

Wafer / Photomask / Substrate Cleaning

Size & Nature of contaminants

Film Frame / Grip Ring?

Film Frame / Grip Ring Sizes

Stretched membrane

Substrate Information

Dimensions, Materials composition, include features, thickness, etc.

Current / desired chemistries

Current process

Issues to resolve / items to address

Throughput: substrates / hr

Process type (7/24 or other)

Automated substrate handling?

Yes
No

Chemical Etch & Strip

Developer Application

Substrate Information

Dimensions, Materials composition, include features, thickness, etc.

Current / desired chemistries

Current process

Issues to resolve / items to address

Throughput: substrates / hr

Process type (7/24 or other)

Automated substrate handling?

Yes
No

Resist Strip

Positive or Negative Resist Strip?

Positive
Negative

Substrate Information

Dimensions, Materials composition, include features, thickness, etc.

Current / desired chemistries

Current process

Issues to resolve / items to address

Throughput: substrates / hr

Process type (7/24 or other)

Automated substrate handling?

Yes
No

Post-CMP Cleaning

Cassette sizing & Substrate qty to be processed

Substrate Information

Dimensions, Materials composition, include features, thickness, etc.

Current / desired chemistries

Current process

Issues to resolve / items to address

Throughput: substrates / hr

Process type (7/24 or other)

Automated substrate handling?

Yes
No

Spin Coating

Coating material, brand / product name

Coating Thickness / Uniformity

Diluent

Cleaning Agent

Substrate Information

Dimensions, Materials composition, include features, thickness, etc.

Current / desired chemistries

Current process

Issues to resolve / items to address

Throughput: substrates / hr

Process type (7/24 or other)

Automated substrate handling?

Yes
No

In-Line Reionization

Flow rate / application requirements

Other / Comments

Other application explanation

Additional Information

Timeline*

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Request for Quote

Company Information

Application Information

Wafer / Photomask / Substrate Cleaning

Chemical Etch & Strip

Resist Strip

Post-CMP Cleaning

Spin Coating

In-Line Reionization

Other / Comments

Additional Information