Mixing Systems
The stand-alone mixing system offers a facilities-driven, manually adjustable, in-line surfactant mixing enclosure that can be connected to a valve-controlled dispense. Includes a level-sensing interface for the concentrate storage container.
Features & Options
Features:
- Internal storag e for up to Five (5) gallons of surfactant concentrate with level-sensing interface
- Adjustable in-line mixing pump, facilities DI H2O driven, standard configuration for .0 – 2% mixing rati
Applications:
- Mixed surfactant dispense to brushes & port flushing interfaces
In-Line Reionizer
The ILR400 is an ideal solution for the problem of electrostatic discharge caused by the use of DI H2O. The system is equipped with a special membrane that mixes the CO2 gas into the water flow, thus controlling the DI H2O resistivity. The design of the ILR400 In-line DI H2O Reionizer System is based on the latest technological developments in its field. It features straight forward & user-friendly controls that allow versatility in application of the pure water process.
Features & Options
Features:
- Up to 4.0 Gal./Min. Re-ionized DI H2O
- Operating ranges of 0.02 to 1.2 MegOhms.
- Digital Resistivity Meter that monitors the output of the DI H2O resistivity.
- Closed loop feedback system with proportional valve & PID Controller to insure consistent reionization at a set point for a variable DI H2O flow rate.
- No CO2 bubbles in the DI H2O line.
- No DI H2O reservoir to allow bacteria growth.
- Check valve to isolate the CO2 from the DI H2O source.
- N2 purge & DI H2O trickle to eliminate bacteria growth during periods of shutdown.
Options:
- Remote Alert Box with LED & Audible alarm for CO2 within range
- Built to CE spec
Applications:
- High-Pressure DI H2O for cleaning Photomasks & Wafers Infrared Heat Lamp for Complete Drying
- High-Pressure DI H2O for cleaning Flat Panel Glass Substrates
- High-Pressure DI H2O for cleaning Wafers during Dicing operations
- Low-Pressure DI H2O for cooling the Dicing blades
- Low-Pressure DI H2O for rinsing Wafers in Rinser-Dryers
Heaters