Chemical Process Systems

FEATURES:

• Adjustable chuck capable of 4”x4” up to 9”x9” (x128 / x138) or 14″x14″ (x133) SEMI standard Photomasks , with Chamber Substrate Compatibility up to 300mm (x133) & 740mm (x134) Diameter
• Capable of 65nm node & better processing.
• Main Spindle Assembly with Servo Motor.
• Oscillating Brush with Programmable Auto Up/Down & Self-Cleaning for Chemical & Heated DI-H₂O Dispenses.
• Integrated & Internally Located Heater Enclosure (externally mounted on x133) for Oscillating Heated DI-H₂O Low Pressure Dispense Arm.
• Backside Heated DI-H₂O for Strip, Clean & Dry Assist.
• Fully Sealed & Radially Exhausted Chamber for Maximum Laminar Flow with N₂ feed from the lid.
• Rinse to pH of entire process area & substrate with Safety Interlocks to prohibit access to process & Drain Diverter Valves for Chemical & Rinse DI-H₂O
• Process Chamber of FM4910 Compliant PVDF with PTFE coated Stainless Steel surfaces & stand-alone FM4910 Compliant Polypropylene Cabinet with Stainless Steel Internal Frame (x128/x134/x138) & Integrated Secondary Containment with Leak Detection.
• Integrated & Exhausted One (1) Gallon Container Chemical storage with non-contact Level Sensing for Nanostrip applications.
• Microprocessor Control with Thirty (30) Recipes having Thirty (30) Steps each, Touch Screen Graphic User Interface with Adjustable Arm Speed & Travel Positions, On-Screen Error Reporting, & Security Lockouts.
• Flat Lid with Push Button Open/Close
• Designed to SEMI S2/S8 Guidelines
• Comprehensive Compact Footprints of 28” wide X 24” deep (x128) & 34” wide X 30” deep (x138) includes Integrated DI H₂O Heater; Chemical Storage; & Secondary Containment. Front Service Access for All Components. Dimensions do not include rear-facing Facilities Connections.
• System Footprint of 43” wide by 43” deep (x133) or 48” wide x 61” deep (x134)

OPTIONS:

• Ability to integrate with Equipment Front End Module (EFM) for Automation purposes
• For Piranha applications, an external chemical cabinet with isolated chambers & a footprint of approx. 26” wide X 18” deep, along with a second pump & hardware, is required.
• Chucks for Various Wafers, Photomask, & other Substrates, Adjustable without requiring removal or special tools.
• Additional Chemical Dispenses through Brush or Dispense Arm. Chemical Mixing at Point of Use is Available.
• Oscillating Megasonic or Atomizing Mist Nozzles for DI-H₂
• Fixed or Oscillating Top or Backside Low Pressure Dispense with various Nozzles for DI-H₂

FEATURES:

• Up to Nine by Nine (9×9) Inch/300mm Diameter Substrate Compatibility.
• Main Spindle Assembly has Brushless Servo Motor for precise speed control & indexing.
• Oscillating Dispense Arms with Recipe-Adjustable Speed & Travel Positions & programmable parabolic travel.
• Radially Exhausted Chamber for Maximum Laminar Flow with N2 feed at Top of the lid.
• DI-H2O Heater for Clean & Dry Assist.
• Process Chamber of FM4910 Compliant PVDF with PTFE coated Stainless Steel surfaces & stand-alone Polypropylene Cabinet with Stainless Steel Internal Frame & Integrated Secondary Containment with Leak Detection.
• Microprocessor Control Capable of Retaining Thirty (30) Recipes having thirty (30) Steps each in Memory.
• Rinse to pH of entire process area & substrate with interlocks to prohibit access to process area & control Drain & Spindle Speed till safe.
• Push Button Lid Open/Close.
• Touch Screen Graphic User Interface (GUI) with Ease of Programming & Security Lockouts with On-Screen Error Reporting.
• Drain Diverters for Chemical & House Drains.
• Designed to SEMI S2/S8 Guidelines Comprehensive Compact Footprint of 28” wide X 24” deep includes Integrated DI H2O Heater; Chemical Storage; & Secondary Containment. Front Service Access for All Components. Dimensions do not include rear-facing Facilities Connections.

OPTIONS:

• Various sizes & types of chucks for Wafers, Photomask, & other Substrates.
• Auto Up/Down Oscillating Adjustable Self-Cleaning Brush Assembly for chemical, Surfactant, & DI-H₂O Dispenses.
• Oscillating Megasonic Nozzles & MegPies for DI-H₂O or Chemical Dispense Arm.
• Fixed or Oscillating Low Pressure Dispense with various Nozzles for DI-H₂O &/or Chemistries.
• Chemical Cabinet with weight Scale Dispense Canisters, Digital Flow Meter & Pump.
• Heater for Chemical & DI-H₂O Dispenses.
• Secondary Containment with Leak Detection
• Point of Use Mixing Systems.
• Expandable Recipe & Recipe Storage.
• FM4910 Fire Retardant Cabinet & Process Area Materials
• Chemical Recovery Systems are based on multiple diverter valves, pumping to drums, & level sensing.

FEATURES:

• Up to 9” x 9”/ 300mm Diameter Substrate Compatibility.
• Main Spindle Assembly has Servo Motor for precise speed control & indexing.
• Adjustable Arm Speed and Travel Positions with Arms of 316SS, with Teflon Coating if required by chemistry.
• DI-H2O Heater for Clean & Dry Assist.
• Process containment of chemically compatible material of Polypropylene, PVDF, or PTFE as required by chemistry.
• Stand-alone Polypropylene Cabinet.
• Microprocessor Control Capable of Retaining Thirty (30) Recipes having Thirty (30) Steps each in Memory. A number of Recipes & Steps are expandable upon request.
• Built-in Safety Interlocks & Double Containment.
• User-Adjustable Timed Chamber Flush with optional Rinse to pH of entire process area & substrate with interlocks to prohibit access to process area & control Drain and Spindle Speed till safe.
• Push Button Lid Open/Close.
• Touch Screen Graphic User Interface (GUI) with Ease of Programming & Security Lockouts with On-Screen Error Reporting.
• Drain Diverter Valves for Chemical & House Drains
• Designed to SEMI S2/S8 Guidelines

OPTIONS:

• Various sizes & types of chucks for Wafers and Substrates.
• Up to Two Process Arms, having profiled oscillation for uniform application & results, including:
  • Auto Up/Down Adjustable Self Cleaning Brush Assembly for Developer, Etch, Stripper & DI-H₂O Dispenses.
  • Megasonic Nozzles for DI-H₂O or Chemical Dispense Arm.
  • Fixed or Oscillating Low Pressure Dispense with various Nozzles for DI-H₂O &/or Chemistries.
  • Atomizing Mist Nozzle Dispense
• Chemical Cabinet with Dispense Canisters, Digital Flow Meter & Pump.
• Heater for Chemical & DI-H₂O Dispenses.
• Substrate Temperature Monitoring.
• Secondary Containment with Leak Detection
• Point of Use Mixing Systems.
• FM4910 Fire Retardant Cabinet & Process Area Materials