Substrate Cleaning Systems (SCS)

The highly efficient Substrate Cleaning Systems are the ideal solution for submicron cleaning of Photomasks, Wafers & Substrates. The very reliable & cost-effective systems utilize a proven assortment of cleaning technologies. The models can be configured with several different cleaning options including Atomizing Mist Nozzle, Brushes, Megasonic Nozzles & Pies, High Pressure DI, & much more. The Rapid & Effective Drying technique combines Variable Spin Speeds, optional Heated DI, Nitrogen Assist or Heat Lamp.

Features & Options

Features:

  • Up to Twelve (12) Inch Diameter Substrate and 9” x 9” Photomask Compatibility on compact models, & up to twenty (20) Inches on the Diagonal/Diameter or Multiple Smaller sizes in larger systems.
  • Main Spindle Assembly having DC Brushless Motor (can be upgraded for more control).
  • Recipe-Controlled Arm Speed & Travel Positions.
  • Radially Exhausted Chamber for Maximum Laminar Flow.
  • Automated D.I. Water Line Purge for maintaining a Bacteria Free System
  • Stand-alone Polypropylene Cabinet. (SCSx128 model has a stand-alone stainless-steel frame with polypropylene cabinet)
  • Microprocessor Control Capable of Retaining Thirty (30) Recipes in Memory each with up to Thirty (30) steps. Expandable to Ninety (90) programs or with up to thirty (30) steps.
  • Built in Safety Interlocks.
  • Push Button Lid Open/Close.
  • Touch Screen Graphic User Interface (GUI) with Ease of Programming, Security Lockouts, On-Screen Error Reporting, & Data Logging. 
  • Up to Two (2) process arms on compact models, and Four (4) process arms in larger systems.
  • Designed to SEMI S2/S8 Guidelines

Options:

  • Various sizes of edge-grip & vacuum chucks for Wafers, Photomasks, & other Substrates      
  • Height Adjustable Self-Cleaning Brush Assembly
  • Recipe-controlled vertical arm travel with 0.1mm travel resolution.
  • N2 Drying Assist with 0.02 µm Filtration
  • Fixed or Oscillating Low Pressure Dispenses 
  • Surfactant or Photoresist Dispense Canisters
  • Stand-Alone & Cabinet-integrated surfactant mixing systems
  • Recipe-controlled process chamber rinse and flush dispenses
  • Controllable & Adjustable Chamber Exhaust Assembly
  • 0.2 µm Filtration for Low Pressure Dispenses
  • D.I. Water Heater & Dispenses
  • Oscillating Megasonic DI Water Dispense Arm
  • Secondary Containment with Leak Detection

Double-Sided Cleaning Systems (DCS)

The Double-Sided Cleaning Systems offer the processing functionality & features of our Substrate Cleaning Systems, with the capability of operating on both sides of a substrate simultaneously.

Features & Options

Features:

  • Up to Twenty-nine (29) Inch Diameter Substrate on-axis Compatibility with Maximum off-axis substrate size of 9” x 9”, allowing for multiple substrates to be processed simultaneously
  • Main Spindle Assembly having Servo Motor with Push Button Indexing
  • Adjustable Process Arm Speed & Travel Positions.
  • Laminar Flow Exhausted Chamber
  • Stand-alone Polypropylene Cabinet. (DCSx607 model has a stand-alone stainless-steel frame with polypropylene cabinet)
  • Push Button lock for front opening & Built-in Safety Interlocks
  • Built-in Chamber flush Assembly & DI-H2O Line Purge for a Bacteria-Free System
  • Microprocessor Control Capable of Retaining Thirty (30) Recipes each with up to Thirty (30) steps in Memory
  • Touch Screen Graphic User Interface (GUI) with Ease of Programming & Security
  • Lockouts, On-Screen Error Reporting with Data Logging & Reporting per Substrate
  • Up to Two (2) process arms on compact models, and Four (4) process arms in larger systems

Options:

  • Various sizes of edge-grip & vacuum chucks for Wafers, Photomasks, & other Substrates      
  • Height Adjustable Self-Cleaning Brush Assembly
  • Recipe-controlled vertical arm travel with 0.1mm travel resolution.
  • D.I. Water Heater & Dispenses
  • N2 Drying Assist with 0.02 µm Filtration
  • Fixed or Oscillating Low Pressure Dispenses 
  • Surfactant or Photoresist Dispense Canisters
  • Stand-Alone & Cabinet-integrated surfactant mixing systems
  • Recipe-controlled process chamber rinse and flush dispenses
  • Controllable & Adjustable Chamber Exhaust Assembly
  • 0.2 µm Filtration for Low Pressure Dispenses
  • Oscillating Megasonic DI Water Dispense Arm
  • Secondary Containment with Leak Detection

Post-CMP Systems (PCS)

The Post-CMP Systems offer a means of quickly and efficiently removing gross contamination from wafer polishing processes. Offering a single-station processing of individual or batches of substrates, when used in combination with the two-point contact carrier the systems offer full and thorough cleaning of substrates in preparation for final cleaning in a single- or double-sided cleaning system.

Features & Options

Features:

  • Compatible with Cassette or Carrier of SEMI standard wafers of up to 300mm.
  • Process tank having nozzles for top down spray of/or bottom fill of chemicals & DI-H2O.
  • Chamber & Substrate Flush for rinse to pH when processing is complete having pH Meter for monitoring the drain output with quick dump for low rinse DI-H2O consumption.
  • Staging (holding) tank for processed substrate having DI-H2O for substrate to maintain a wet state while waiting for further processing.
  • Reservoir tanks for recirculation chemistries & Temperature maintenance.
  • Stand-alone Surfactant mixing system for automatic refill.
  • Exhausted Process Chamber & Lower Cabinet.
  • Stand-alone Polypropylene Cabinet with all wetted surfaces of PVDF (optional other materials) for Chemical & Temperature Compatibility.
  • Built in Safety Interlocks.
  • Push Button Lid Open/Close on process tank.
  • Microprocessor Control Capable of Retaining up to Thirty (30) Process Programs in Memory with each capable of up to 30 Recipe Steps.
  • Touch Screen Graphic User Interface (GUI) with Ease of Programming & Security Lockouts and On-Screen Error Reporting.

Options:

  • Heater Element (Teflon coated as need) in Reservoir to Maintain fluids at required temperature.
  • Filters for removing contamination from reusable chemistries.
  • Megasonic Plate for enhanced Cleaning
  • Agitation crank for Substrate Carrier
  • Substrate Carriers to Enhance Cleaning with two point contact & open profile.
  • Secondary Containment with Leak Detection
  • Stainless Steel frame, skin, and structure for Automation Ready Interface.
  • Diverter valves for segregation of drains (chemical & facilities) & directing recapture of reusable chemistries
  • Load assist mechanisms for larger & heavier loads.
  • Built to SEMI & CE Certification Standards

System Models & Brochures

Substrate Cleaning Systems
Model Max # process arms Substrate size range System dimensions Brochure
SCSx124 2 12” diagonal / diameter

9″ x 9″ square

29.5” wide X 27.75” deep

Heater option adds additional 7.5” to depth

Download
SCSx126 4 12” diagonal / diameter

9″ x 9″ square

34.5” wide X 27.75” deep

Heater option adds additional 7.5” to depth

Download
SCSx128 2 12” diagonal / diameter

9″ x 9″ square

28” wide x 24” deep

Heater option integrated into system cabinet

Download
SCSx133 4 20” diagonal / diameter

14″ x 14″ square

43” wide x 37” deep

Heater option adds additional 7.5” to depth

Download
Double-Sided Cleaning Systems
Model Max # process arms Substrate size range System dimensions Brochure
DCSx606 2 17″ diagonal / diameter 25″ wide x 41″ deep Download
DCSx607 4 29″ diagonal / diameter 48″ wide x 61″ deep Download
Double-Sided Cleaning Systems
Model Max # process arms Substrate size range System dimensions Brochure
PCSx126 N/A Scalable up to 300mm 34.5” wide X 27.75” deep

(Excludes external heaters / surfactant mixing units)

Download
PCSx133 N/A Scalable up to 450mm 43″ wide x 37″ deep

(Excludes external heaters / surfactant mixing units)

Download